供应wifi蓝牙二合一智能物联网wifi模块8723RD2

 

BL-R8723RD2
SPECIFICATION  
IEEE 802.11 b/g/n 2.4GHz 1T1R WiFi with Bluetooth2.1 /3.0/4.0,with SDIO INTERFACE, and HS-UART MIXED INTERFACE
Version: 1.0

Customer	
Date	
Model Name	BL-R8723RD2
Part NO.	
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ENGINEER	
QC	
SALES
		
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ENGINEER	
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MANUFACTORY	
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Contents

1. General Description	2
2.	The range of applying	2
3.	Product Specification	2
3.1 Function Block diagram	2
3.2 Electrical and Performance Specification	3
3.3Power Supply DC Characteristics	4
3.4 RF Characteristic	4
3.5 Product Photo	5
3.6 Mechanical Specification	5
3.7 Product Pin Definition	6
4. Supported platform	8
5. Peripheral Schematic Reference Design	8
6. Package Information	9
7. Typical Solder ReflowProfile	9
8. Precautions for use	9



















1. General Description
BL-R8723RD2 is a small size and low profile of WiFi+BT combo module  with LGA (Land-Grid Array) footprint, board size is 12mm*12mm with module height of 1.6mm. It can beeasily manufactured on SMT process and highly suitable for tablet PC, ultra book, mobile  device and consumer products. It provides GSPI/SDIO interface for WiFi to connect with host processor and high speed UART interface for BT. It also has a PCM interface for audio data transmission with direct link to external audio codec via BT controller. The WiFi throughput can go up  to 150Mbps in theory by using 1x1 802.11n b/g/n MIMO technology and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.0.   
2.	The range of applying
MID, networking camera, STB GPS, E-book, Hard disk player, Network Radios, PSP, etc, the device which need be supported by wireless networking.
3.	Product Specification
3.1 Function Block diagram
 


3.2 Electrical and Performance Specification
Item	Description
Product Name 	BL-R8723RD2
Major Chipset	RTL8723BS
Host Interface 	SDIO 1.1/ 2.0/ 3.0
Standard	WiFi:IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11d, IEEE   802.11e, IEEE 802.11h, IEEE 802.11i
BT:  V2.1+EDR/BT v3.0/BT v3.0+HS/BT v4.0
Frequency Range	2.4GHz~2.4835GHz
Modulation Type	Wifi：802.11b: CCK, DQPSK, DBPSK
802.11g: 64-QAM,16-QAM, QPSK, BPSK
802.11n: 64-QAM,16-QAM, QPSK, BPSK
BT:  8DPSK, π /4 DQPSK, GFSK
Working Mode	Infrastructure,  Ad-Hoc
Data Transfer Rate	Wifi：802.11b: 11, 5.5, 2, 1 Mbps
802.11g: 54, 48, 36, 24, 18, 12, 9, 6 Mbps
802.11n: MCS 0 to 7 for HT20MHz ;MCS 0 to 7 for HT40MHz
BT:1 Mbps for Basic Rate
2,3 Mbps for Enhanced Data Rate
Spread Spectrum	IEEE 802.11b: DSSS (Direct Sequence Spread Spectrum)
IEEE 802.11g/n:OFDM (Orthogonal Frequency Division Multiplexing)
BT: FHSS(Frequency-Hopping Spread Spectrum)
Sensitivity @PER	WiFi: 135M:-68Bm@10%PER
54M:-74Bm@10%PER；
11M:-86dBm@10%PER；
6M: -89Bm@10%PER；
1M: -92dBm@10%PER
BT: -89dBm@1Mbps, -85dBm@2Mbps, -83dBm@3Mbps；
 RF Power(Typical)	WiFi: 16dBm@11b, 13dBm@11g ,12dBm@11n
BT: MAX +10dBm
Antenna type	Connect to the external antenna through the half hole
The transmit distance	WiFi: Indoor 100M, Outdoor 300M, according the local environment
BT: 10m MAX.
Dimension(L*W*H)	12.0*12.0*1.6mm (LxWxH) ，Tolerance: +-0.15mm
Power supply	3.3V +/-0.2V
Power Consumption	standby mode 65mA@3.3V , 
TX mode 285mA@3.3V
Clock source	26MHz
Working Temperature 	0°C to +50°C
Storage temperature	-40°C to +85°C
3.3Power Supply DC Characteristics
Terms	Contents
Specification : IEEE802.11b
Mode	DSSS / CCK
Frequency	2412 – 2484MHz
Data rate	1, 2, 5.5,11Mbps
DC Characteristics	min	Typ.	max.	unit
TX mode	245	285	307	mA
Rxmode	64	64	65	mA
Sleepmode	63	64	65	mA
Specification : IEEE802.11g
Mode	OFDM
Frequency	2412- 2484MHz
Data rate	6, 9, 12, 18, 24, 36, 48, 54Mbps
DC Characteristics	min	Typ.	max.	unit
TX mode	160	230	270	mA
Rxmode	64	64	65	mA
Sleepmode	63	65	65	mA
Specification : IEEE802.11n
Mode	OFDM
Frequency	2412- 2484MHz
Data rate	6.5,13, 19.5,26, 39, 52, 58.5, 65Mbps
DC Characteristics	min	Typ.	max.	unit
TX mode	155	207	283	mA
Rxmode	68	68	69	mA
Sleepmode	67	68	69	mA

3.4 RF Characteristic
Mode	Rate(Mbps)	Power(dBm)	EVM(dB)	Sensitivity(dBm)
		CH1	CH7	CH13	CH1	CH7	CH13	CH1	CH7	CH13
11b	1	17.47	17.74	16.73	-26.39	-28.12	-23.81	-92	-92	-92
	11	17.62	17.41	16.68	-28.79	-27.85	-27.26	-86	-86	-86
11g	6	17.32	17.50	17.10	-21.23	-21.18	-21.19	-89	-89	-89
	54	14.19	14.05	14.22	-31.32	-31.95	-31.98	-74	-74	-74
11n
HT20	MCS0	17.02	17.20	17.30	-22.99	-23.89	-24.50	-88	-88	-88
	MCS7	14.02	14.11	14.12	-31.97	-32.00	-31.89	-70	-70	-70
11n
HT40	MCS0	16.59	16.40	16.02	-23.81	-24.40	-26.07	-87	-87	-87
	MCS7	13.65	13.76	13.40	-30.21	-32.02	-31.51	-68	-68	-68
3.5Product Photo
TOP Bottom
  

3.6 Mechanical Specification
Tolerance: +-0.15mm
 
3.7 Product Pin Definition
 
Pin No：	Function 	Description
1	GND 	Grond 
2	WIFI/BT_ANT 	WIFI/BT_ANT 
3	GND 	Grond 
4,5	NC	NC
6	BT_WAKE 	HOST wake-up Bluetooth device
7	BT_HOST_WAKE 	Bluetooth device to wake-up HOST  
8	NC	NC
9	VABT 	3.3V 
10,11	NC	NC
12	WL_DSI# 	Shared with GPIO9 This Pin Can Ex ternally Shutdown the RTL8723BS   
WLAN function when BT_DISn is Pulled Low. When this pin deasserted, 
SDIO interface will be disabled. This pin can also support the WLAN Ra 
dio-off function with host interface remaining connected. 
13	WL_HOST_WAKE 	WLAN to wake-up HOST 
14	SD_D2 	SDIO data line 2 
15	SD_D3 	SDIO data line 3
16	SD_CMD 	SDIO command line 
17	SD_CLK 	SDIO CLK line 
18	SD_D0 	SDIO data line 0 
19	SD_D1 	SDIO data line 1
20	GND	Grond
21	NC	NC
22	VDD_IO 	1.8V / 3.3V
23	NC	NC
24	SUSCLK_IN	Shared with GPIO6. External 32K or RTC clock input with 1.8V ~ 3.3V   
swing. This clock source is configured by BT and WL FW, respectively.  
25	PCM_DOUT 	PCM Data output
26	PCM_CLK 	PCM Clock
27	PCM_DIN 	PCM data input
28	PCM_SYNC 	PCM sync **  
29,30	NC	NC
31	GND 	Grond
32	NC	NC
33	GND 	Grond
34	BT_DIS# 	General Purpose Input/Output Pin 
35	NC	NC
36	GND 	Grond
37,38,39,40,41	NC	NC
42	UART_OUT 	HOST Data output
　      43	UART_IN 	HOST Data input 
　      44	UART_CTS 	HOST_CTS 

4. Supported platform
Operating System	CPU Framework	Driver
WIN2000/XP/VISTA/WIN7	X86 Platform	Enable
LINUX2.4/2.6	ARM, MIPSII	Enable
WINCE5.0/6.0	ARM ,MIPSII	Enable
5. Peripheral Schematic Reference Design
 
6. Package Information
 
7. Typical Solder ReflowProfile
 
8. Precautions for use
1. Pls handle the module under ESD protection.
2. Reflow soldering shall be done according to the solder reflow profile. Peak temperature
245℃.
3.Products require baking before mounting if humidity indicator cards reads >30% temp <30 degree C, humidity < 70% RH, over 96 hours. 
Baking condition: 125 degree C, 12 hours
Baking times: 1 time
4. Storage Condition: Moisture barrier bag must be stored under 30 degree C, humidity under 85% RH. The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date. Humidity indicator cards must be blue, <30%.