BL-R8188EU1(EUS) Product Specification WLAN 11b/g/n USB MODULE Approval Sheet Customer Date Product Type BL-R8188EU1 Part NO. Blink Approve Field ENGINEER QC SALES Customer Approve Field ENGINEER QC MANUFACTORY PURCHASING Content Content 1 0. Revision History 2 1. General Description 2 2. The range of applying 2 3. Product Specification 2 3.1 Function Block diagram 2 3.2 Electrical and Performance Specification 3 3.3 DC Characteristic 3 3.4 RF Characteristic 4 3.5 Product Photo 5 3.6 Mechanical Specification 5 3.7 Product Pin Definition 6 4. Supported platform 7 5. Peripheral Schematic Reference Design 7 6. Package Information 8 7. Typical Solder Reflow Profile 8 8. Precautions for use 9 0. Revision History Date Document revision Product revision Change Description 2014/06/18 1.0 V2.7 Update format , change product size tolerance. 1. General Description BL-R8188EU1 product is designed base on Realtek RTL8188EUS chipset .It combines CMOS MAC, Baseband PHY and RF in a single chip for IEEE 802.11/b/g/n compatible. It supports IEEE802.11i safety protocol, along with IEEE 802.11e standard service quality. It supports the new data encryption on 64/128 bit WEP and safety mechanism on WPA-PSK/WPA2-PSK, WPA/WPA2. It can implement the wireless network function on the laptop/desktop/MID and other wireless devices easily . This module has implemented some efficient mechanisms in its software and hardware to maximize the performance. 2. The range of applying MID, networking camera, STB GPS, E-book, Hard disk player, Network Radios, PSP and other device which need be supported by wireless networking. 3. Product Specification 3.1 Function Block diagram 3.2 Electrical and Performance Specification Item Description Product Name BL-R8188EU1 Major Chipset RTL8188EUS Host Interface USB2.0 Standard IEEE 802.11b, IEEE 802.11g,IEEE 802.11n, Frequency Range 2.4GHz~2.4835GHz Modulation Type 802.11b: CCK, DQPSK, DBPSK 802.11g: 64-QAM,16-QAM, QPSK, BPSK 802.11n: 64-QAM,16-QAM, QPSK, BPSK Working Mode Infrastructure, Ad-Hoc Data Transfer Rate 1,2,5.5,6,11,12,18,22,24,30,36,48,54,60,90,120 and maximum of 150Mbps Spread Spectrum IEEE 802.11b: DSSS (Direct Sequence Spread Spectrum) IEEE 802.11g/n:OFDM (Orthogonal Frequency Division Multiplexing) Sensitivity @PER 1M: -90dBm@8%PER 6M: -88dBm@10%PER 11M:-86dBm@8%PER 54M:-73dBm@10%PER 135M:-68dBm@8%PER RF Power(Typical) 16dBm@11b, 14dBm@11g , 13dBm@11n, Antenna type Connect to the external antenna through the half hole The transmit distance Indoor 100M, Outdoor 300M, according the local environment Dimension(L*W*H) 13.0 x 12.3 x 1.55mm (LxWxH) ;Tolerance: +-0.2mm Power supply 3.3V +/-0.2V Power Consumption standby mode 140mA@3.3V , TX mode 245mA@3.3V Clock source 40MHz Working Temperature 0°C to +50°C Storage temperature -40°C ~ +85°C 3.3 DC Characteristic Terms Contents Specification : IEEE802.11b Mode DSSS / CCK Frequency 2412 – 2484MHz Data rate 1, 2, 5.5, 11Mbps DC Characteristics min Typ. max. unit TX mode 257 263 271 mA Rx mode 80 82 84 mA Sleep mode 78 80 82 mA Specification : IEEE802.11g Mode OFDM Frequency 2412 - 2484MHz Data rate 6, 9, 12, 18, 24, 36, 48, 54Mbps DC Characteristics min Typ. max. unit TX mode 244 245 245 mA Rx mode 88 89 89 mA Sleep mode 78 80 82 mA Specification : IEEE802.11n Mode OFDM Frequency 2412 - 2484MHz Data rate 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps DC Characteristics min Typ. max. unit TX mode 201 207 214 mA Rx mode 90 93 94 mA Sleep mode 78 80 82 mA 3.4 RF Characteristic Mode Rate(Mbps) Power(dBm) EVM(dB) Sensitivity(dBm) CH1 CH7 CH13 CH1 CH7 CH13 CH1 CH7 CH13 11b 1 17.43 17.36 17.20 -28.27 -28.11 -27.86 -95 -94 -94 11 17.91 17.77 17.68 -23.42 -24.02 -24.21 -86 -86 -86 11g 6 15.39 15.22 15.33 -32.02 -31.43 -31.17 -90 -90 -90 54 14.79 14.81 15.11 -33.03 -32.63 -32.31 -74 -73 -73 11n HT20 MCS0 15.02 15.12 15.33 -32.14 -31.66 -32.88 -90 -90 -90 MCS7 14.75 14.67 14.66 -32.40 -31.29 -31.60 -70 -70 -70 Mode Rate(Mbps) Power(dBm) EVM(dB) Sensitivity(dBm) CH3 CH7 CH11 CH3 CH7 CH11 CH3 CH7 CH11 11n HT40 MCS0 15.52 15.53 15.33 -32.54 -31.47 -32.49 -88 -88 -88 MCS7 14.65 14.6 14.76 -32.51 -31.39 -31.92 -68 -68 -68 3.5 Product Photo TOP Bottom 3.6 Mechanical Specification Module dimension: Typical (L x W x H): 13mmx12.3mmx1.55mm Tolerance : +/-0.2mm 3.7 Product Pin Definition 4. Supported platform Operating System CPU Framework Driver WIN2000/XP/VISTA/WIN7 X86 Platform Enable LINUX2.4/2.6 ARM, MIPSII Enable WINCE5.0/6.0 ARM ,MIPSII Enable 5. Peripheral Schematic Reference Design 6. Package Information 7. Typical Solder Reflow Profile 8. Precautions for use 1. Pls handle the module under ESD protection. 2. Reflow soldering shall be done according to the solder reflow profile. Peak temperature 245℃. 3. Products require baking before mounting if humidity indicator cards reads >30% temp <30 degree C, humidity < 70% RH, over 96 hours. Baking condition: 125 degree C, 12 hours Baking times: 1 time 4. Storage Condition: Moisture barrier bag must be stored under 30 degree C, humidity under 85% RH. The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date. Humidity indicator cards must be blue, <30%.